HOZAN Lead-Free Solder, Sn-0.3Ag-0.7Cu, 400g, HS-352

Cost-effective lead-free solder.

Uses a flux that emphasizes wettability, minimizing degradation in workability.

Switching from Sn-3Ag-0.5Cu solder does not require new equipment or major changes to work methods. *The image shown is for illustrative purposes only and may differ in color and specifications from the actual product.

Composition: Sn-0.3Ag-0.7Cu Temperature (°C) Solid/Liquid: 217/226 Wire Diameter (mmφ): 0.6 Length (m): 235 Bobbin Type: L