4Pcs Universal Bga Reballing Stencil For Mtk Msm Cpu Pm Power Ic Planting Soldering Net

Description: 100 brand new and high quality. Feature: These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC. Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use. High success rate of planting tin, the solder balls can be formed once when you are proficient. Simple and convenient to use. BGA Reballing Stencil only, accessories demo in the picture is not included! Specifications: Item Type:BGA Reballing Stencil Material:Stainless Steel Size:Standard Size Color:Silver Size:19.5*9.5*0.2cm Quantity:4PCS Note: No retail package. Transition:1cm=10mm=0.39inch Please allow 1-3mm error due to manual measurement. pls make sure you do not mind before you bid. Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you! Package Includes: 4 x BGA Reballing Stencils The merchant warrants that their products comply with all applicable laws, and are offered only if they comply with Joom's policies and EU Product Safety and Compliance laws.